Surface Mount Technology

At Stewart Technology, our Surface Mount Technology (SMT) capabilities form the backbone of our high-quality electronics manufacturing services. With advanced Siplace placement lines, skilled technicians and strict process control, we deliver PCB assemblies that meet the highest standards of accuracy, consistency and reliability.

SMT enables compact, high-density circuit designs, fast throughput and exceptional repeatability. Whatever your requirements, Stewart Technology provides dependable SMT assembly tailored to your needs.

Advanced Siemens SMT Lines

Our Siplace Surface Mount lines are engineered for speed, precision and versatility, with the theoretical capacity to place three million components in a single shift.

Each of our four SMT lines are fully standardised, giving us exceptional flexibility in production planning, rapid changeovers and the ability to adapt to customer needs quickly and efficiently.

In-House Programming and Operator Expertise

We take pride in being fully self-sufficient in machine programming and maintenance. Our responsible, cross-trained machine operators manage each line with precision, conducting thorough first-off checks for every board assembled. This ensures correct setup, stable processes and consistent high-quality results from the very first unit.

High Performance Printing and Reflow

Our SMT lines are equipped with:

DEK solder paste printers with advanced vision alignment technology

High quality stencils for consistent and accurate paste deposition

Modern reflow ovens with optimised thermal profiling

These assets allow us to achieve predictable solder joints, stable results and strong mechanical and electrical connections across all assemblies.

How it Works

Solder Paste Print

In this stage, solder paste is precisely applied to the desired areas of the PCB through a stencil using our automated DEK printers. The controlled deposition forms the foundation for strong solder joints, reliable electrical connections and consistent overall assembly quality. 

Component Placement

After the solder paste has been applied the board moves to our Siplace pick and place machines

The machines use high-speed vacuum nozzles to pick components from reels or trays

Vision systems check component orientation, rotation and dimensions

Components are precisely placed on the solder-pasted pads

Even ultra-fine or miniature components can be positioned with extreme accuracy

PCBA Reflow

The PCB then enters a controlled reflow oven where the solder paste melts and bonds the components to the pads.

The boards pass through temperature-controlled zones – preheat, soak, reflow and cooling

Each product receives a customised thermal profile based on material, component size and solder type

Controlled heating prevents tombstoning, voiding and thermal shock

Inspection

Every assembly will undergo rigorous inspection to confirm components are correctly placed and soldered. Our inspection technologies include –

Scanspection AOI – surface level defects, solder bridges, polarity issues and misalignment

TruView Prime X-ray – hidden joints such as BGAs, QFNs and internal solder structures

Mantis high-magnification inspection – fine details, prototypes or rework validation

First-off inspection by trained technicians to verify process stability before batch production

Why Choose Stewart Technology for SMT?

Competitive, Value-Driven Pricing

Our efficient processes, experienced staff and in-house capabilities allow us to offer highly competitive pricing without compromising on quality – we are rarely beaten on cost for equivalent capability.

Highly Skilled, Cross-Trained Operators

Our operators are trained across multiple roles, enabling them to confidently run, monitor and verify SMT processes. Every job receives a detailed first-off check to ensure correct setup, alignment, component verification and solder paste quality before full production begins.

Comprehensive Inspection at Every Stage

Using AOI, X-ray and Mantis inspection systems, we verify everything from placement accuracy to hidden solder joints. This multi-layered approach gives customers complete confidence that each assembly meets strict quality expectations.

Interested in Our Services?

If you are interested in how our Electronic Manufacturing Services could benefit your business please contact us!