Stewart Technology offer a comprehensive range of manufacturing related services.

MANUFACTURING TECHNOLOGY

Surface mount 0402 - Ball Grid Array (including micro BGA) placement capability.
Convection reflow.
Lead-Free and conventional leaded assembly available.
Computerised thermal wave and reflow profiling.
Conventional and mixed technology assembly.
Dual wave soldering including SMT chip-wave facility. Maximum PCB placement size: 18" x 18".
Wave solder: 24" x 24".
Repair & rework including BGA.

TEST

Development of comprehensive test strategies.
In-Circuit Test (ICT) and Functional test capabilities.
Ability to create our own test jigs.

FLEXIBILITY

Fast-track from design to manufacture.
Fast response to customers' changing needs.

DESIGN

Multiple PCB design layout format supported.
Customer Electronic Data transfer direct to manufacturing processes.
Design for Manufacture (DFM) and Design for Test (DFT) specialists.

QUALITY STANDARDS AND APPROVALS

ISO 9001-2000

PEOPLE

Highly skilled workforce includes PCB design engineers, DFM / DFT specialists, process and quality engineers, materials specialists, assembly operators.