Stewart Technology offer a comprehensive range of manufacturing related services.MANUFACTURING TECHNOLOGYSurface mount 0402 - Ball Grid Array (including micro BGA) placement capability. Convection reflow. Lead-Free and conventional leaded assembly available. Computerised thermal wave and reflow profiling. Conventional and mixed technology assembly. Dual wave soldering including SMT chip-wave facility. Maximum PCB placement size: 18" x 18". Wave solder: 24" x 24". Repair & rework including BGA. TESTDevelopment of comprehensive test strategies. In-Circuit Test (ICT) and Functional test capabilities. Ability to create our own test jigs. FLEXIBILITYFast-track from design to manufacture. Fast response to customers' changing needs. DESIGNMultiple PCB design layout format supported. Customer Electronic Data transfer direct to manufacturing processes. Design for Manufacture (DFM) and Design for Test (DFT) specialists. QUALITY STANDARDS AND APPROVALSISO 9001-2000 PEOPLEHighly skilled workforce includes PCB design engineers, DFM / DFT specialists, process and quality engineers, materials specialists, assembly operators.
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